Description
Series
Team G70 PRO
Capacity
4 TB
Form Factor
M.2 2280
Interface
PCIe 4.0 x4
Read
Up to 7400 MB/s
Write
Up to 6800 MB/s
Weight/Dimensions
7g
22 x 80 x 3.7 mm (with graphene heatsink)
22 x 80 x 3.7 mm (with graphene heatsink)
Operating Temperatures
0°C~70°C
Storage Temperatures
-40°C~85°C
Shock Resistance
1500G / 0.5ms
Vibration Operating
80Hz ~ 2000Hz/20G
MTBF
3,000,000 Hours
Total Bytes Written (TBW)
2960 TBW
Additional Features
3D NAND Flash
Preset controller solutions
Patented graphene heat-sink
Smart product status monitoring system
An environmental protector
Preset controller solutions
Patented graphene heat-sink
Smart product status monitoring system
An environmental protector
Package Type
Retail
Package Weight
0.0150 kg
